Finned top and flat top designs refer to different ways of thermal design of optical modules. This will directly affect the transmission stability and overall performance of the module. This article will explain what they are and how to choose them.
Finned top vs. Flat top
Finned top refers to the top of the optical module with a fin-like structure. This design can improve heat dissipation, usually used in high-power equipment that requires a lot of heat dissipation.
Flat top means that the surface of the optical module is flat. This design is usually used for lower-power modules.
How to Choose: Finned-top or Flat-top?
Power Consumption and Heat Dissipation
400G and 800G modules often have to handle extremely high bandwidths and transmissions, which can generate a lot of heat. Finned top can dissipate heat by increasing the surface area in contact with air.
For some lower power consumption optical modules, the flat-top design is sufficient to meet their heat dissipation needs.
Transmission Performance and Bandwidth Requirements
In order to ensure the stability of 400G and 800G optical modules in high bandwidth transmission, we can choose the fin design to reduce the heat problem caused by high power consumption and ensure transmission stability.
For lower data transmission rates, a flat-top design is sufficient.
Space and size constraints
The fin design is relatively large due to the need for heat dissipation fins to enhance heat dissipation. If you’re deploying a network environment that is a large-scale data center or a high-density rack, a fin design is an ideal choice.
The flat-top design of the optical module has a simpler structure and occupies less space, making it ideal for equipment with limited space or small computer rooms.
Cost vs. complexity
Finned top need to be precisely designed and manufactured, which often leads to increased transceiver costs. And it would increase production cycle times and manufacturing difficulties.
The flat-top design has no additional heat dissipation structure, the design and production process is relatively simple, and the manufacturing cost is low, which is suitable for mass production and fast delivery.
Environmental factors and usage scenarios
In scenarios where the ambient temperature is high or the device is under high load, the fin design can effectively help dissipate heat, thereby improving the reliability and stability of the module.
In a normal environment, the flat-top design is suitable for low-power network equipment, especially standard racks in data centers or devices with strict space requirements.
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